rbpu_datasheet/chapters/03_pin_description.md

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# 管脚配置与功能描述
## 管脚顶视图
![pin_map](../assets/pin_map.png)
## 管脚定义
@import "data/pin_name.csv" using render_table.py
## BGA 焊球位置
下表列出芯片 13 × 13 BGA 焊球阵列中各位置的信号分配。
@import "data/pin_loc.csv" using render_bga.py
## 封装尺寸
| 参数 | 规格 | 单位 |
|:-|:-|:-|
| 焊球间距 | 1.0 | mm |
| 焊球直径 | 0.5 | mm |
| 焊球数量 | 13 × 13 = 169 | 个 |
| 基板尺寸 | 14 × 14 | mm |
| 封装类型 | CSP-BGA | — |