14 lines
254 B
Markdown
14 lines
254 B
Markdown
|
# 芯片尺寸
|
|||
|
|
|
|||
|
|
|
|||
|
|
|
|||
|
|
## 封装参数
|
|||
|
|
|
|||
|
|
| 参数 | 值 |
|
|||
|
|
|:-|:-|
|
|||
|
|
| 焊球中心间距 | 1 mm |
|
|||
|
|
| 焊球大小 | 0.5 mm |
|
|||
|
|
| 焊球数量 | 13 × 13 = 169 个 |
|
|||
|
|
| 基板大小 | 1.4 cm × 1.4 cm |
|
|||
|
|
| 封装类型 | CSP-BGA |
|